| 參數名稱 | 參數值 |
|---|---|
| Product Status | Active |
| Type | PGA |
| Number of Positions or Pins (Grid) | 155 (18 x 18) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30.0μin (0.76μm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Carrier, Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Post | 200.0μin (5.08μm) |
| Contact Material - Post | - |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature | - |
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Mill-Max IC插座 產品 614-93-155-18-121001
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